![Gordon-Moore](https://www.labwarechem.com/wp-content/uploads/2024/02/Gordon-Moore-768x527.jpg)
Moore's Law, Function Density Law, Function Density, Function UNITs, 6-level classification of electronic system, Function Cell, Function Block, Function Unit, Microsystem, Common System, Giant system.
![ISOTOPE](https://www.labwarechem.com/wp-content/uploads/2024/02/ISOTOPE.png)
Isotopes are separated and extracted from the nuclear fuel reprocessing liquid. This isotope is usually called a split isotope.
![dicing-process](https://www.labwarechem.com/wp-content/uploads/2024/01/dicing-process-768x512.webp)
Wafer dicing (dicing) refers to the process of cutting a single wafer into multiple independent chips ("die").
![](https://www.labwarechem.com/wp-content/uploads/2024/01/Pomalloy.jpg)
Pomalloy is an essential ferromagnetic material in the manufacturing process of MEMS magnetic devices.
![ICP-etching-machine-structure-and-etching-examples](https://www.labwarechem.com/wp-content/uploads/2024/01/ICP-etching-machine-structure-and-etching-examples.webp)
Dry etching technology is an etching process carried out under atmospheric or vacuum conditions.
![Die-Attach](https://www.labwarechem.com/wp-content/uploads/2024/01/Die-Attach-768x432.webp)
Silicon: Although the process is becoming increasingly complex, thanks to the maturity of the industrial chain, the production cost of silicon is relatively controllable.
![Varian instrument](https://www.labwarechem.com/wp-content/uploads/2024/01/Varian-instrument.webp)
Opening ammonia and concentrated hydrochloric acid bottles should be done in a fume hood.
![ASIC](https://www.labwarechem.com/wp-content/uploads/2024/01/ASIC-768x477.png)
It introduces what ASIC is, what FPGA is, and what the principles of the two are.
![SiH4](https://www.labwarechem.com/wp-content/uploads/2024/01/SiH4-768x360.webp)
There are three ways for semiconductors to change resistivity: in-situ doping, diffusion and ion implantation. What are the processes of these three ways and what are the differences?
![Nitride-sputtering-target](https://www.labwarechem.com/wp-content/uploads/2024/01/Nitride-sputtering-target.webp)
The target material is one of the key components of the sputtering machine, which directly determines the deposition quality of the film.